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ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)onsemi · Seremban, M05, Malaysia
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ENGR STAFF, R&D ENGINEERING; DSGN (SIMULATION ENGINEER)

🗓️ Posted 2026-09-15 Seremban, M05, Malaysia Permanent Hybrid Engineering
💰 Salary Not shared 📊 Market RM4,500–RM8,000/mo

About the Company

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits About the Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Responsibilities

  • ● Perform thermo-mechanical simulations and analyses of semiconductor packages, power modules, and electronic assemblies using finite element analysis (FEA) tools.
  • ● Develop simulation models to evaluate thermal performance, stress, warpage, deformation, and reliability risks during product development.
  • ● Support package and material selection by assessing mechanical integrity and thermal behavior under various operating conditions.
  • ● Conduct root-cause investigations and failure analysis through simulation-driven approaches.
  • ● Collaborate with cross-functional teams including package design, product engineering, process development, reliability, and manufacturing to optimize product performance.
  • ● Develop and improve simulation methodologies, modeling techniques, and correlation practices with experimental data.
  • ● Generate technical reports, present simulation findings, and provide recommendations for design improvements.
  • ● Support technology roadmaps and innovation projects related to advanced packaging, power semiconductor devices, and new materials.

Requirements

  • ● Bachelor's, Master's, or PhD in Mechanical Engineering, Materials Engineering, Physics, or a related discipline.
  • ● Good experience with FEA tools such as ANSYS Mechanical, ANSYS Icepak, Abaqus, COMSOL, or equivalent.
  • ● Knowledge of semiconductor packaging, power modules, thermal management, reliability, and material characterization.
  • ● Strong analytical, problem-solving, and communication skills.