search Browse Jobs
NPI Leadframe / Die Attach ManagerSTMicroelectronics · Muar, M01, Malaysia
STMicroelectronics logo

STMicroelectronics

company page ↗

NPI Leadframe / Die Attach Manager

🗓️ Posted 2026-09-18 Muar, M01, Malaysia Permanent Hybrid Manufacturing Transport Logistics
💰 Salary Not shared 📊 Market RM12,000–RM18,000/mo

About the Company

OUR STORY At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today. When you join ST, you will be part of a global business with more than 122 nationalities, present in 40 countries, and comprising over 49,000 diverse and dedicated creators and makers of technology around the world. Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential. Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you. POSITION SUMMARY: The NPI Leadframe / Die Attach Manager is responsible for leading new product introduction, process development, and material qualification activities for leadframe, substrate, and die attach technologies. This role ensures robust process transfer, technical readiness, and manufacturing stability through close coordination with R&D, manufacturing, quality, supply chain, and equipment vendors. The position also drives process standardization, risk mitigation, and continuous improvement for assembly-related technologies. YOUR ROLE Lead and manage the NPI leadframe, su

Requirements

  • ● Strong knowledge of process characterization, DOE, JMP, SPC, and structured problem-solving tools.
  • ● Familiarity with die attach equipment performance, process capability, and vendor assessment.
  • ● Understanding of assembly design rules, material behavior, and interactions between materials, process, and reliability.
  • ● Strong project management skills with the ability to lead cross-functional and multi-site activities.
  • ● Proven analytical, troubleshooting, and decision-making capabilities.
  • ● Strong communication, negotiation, and stakeholder management skills.
  • ● Ability to work effectively in a multicultural and fast-paced manufacturing environment.
  • ● Fluent in English, both written and spoken.
  • ● ST is proud to be one of the 17 companies certified as a 2026 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.
  • ● At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.
  • ● To discover more, visit st.com/careers.