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Staff Process Engineer
Engineering
💰 Salary Not shared
📊 Market RM6,000–RM10,000/mo (RM72,000–RM120,000/yr)
About the Company
Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
Responsibilities
- ● Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
- ● Ramp up manufacturing volume and qualify required sources.
- ● Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
- ● Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
- ● Manage Product Lifecycle Management documents to the latest status.
- ● Conduct change-management with suppliers to sustain / improve capacity and cost.
- ● Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
- ● Serve as the key manufacturing engineering interface for NPI-to-production transfers
- ● Manage OSAT and contract manufacturing relationships supporting production
Requirements
- ● Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
- ● Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
- ● Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
- ● Knowledge of wire bonding.
- ● Knowledge of SPC and statistical analysis software (such as JMP).
- ● Strong interpersonal and communication skills in English.
- ● Strong analytical, written communication and presentation skills. Able to manage large projects effectively.
- ● Cu Clip, Thin Die, Power QFN
- ● Package development knowledge
- ● Experience transitioning products from Development to Production
- ● Experience supporting NPI to Mass Production
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