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ENGR I, MANUFACTURING EQUIP; MFG
Engineering
Company shared salary
NA
Market rate
RM3,000–RM5,000/mo (RM36,000–RM60,000/yr)
Based on similar roles (title + domain + location).
About the Company
Responsible for supporting Assembly manufacturing equipment, driving equipment reliability and leading New Product Introduction (NPI) activities for new package and product development. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Responsibilities
- ● Support assembly equipment uptime, OEE and maintenance programs.
- ● Lead equipment qualification and readiness for NPI programs.
- ● Coordinate with Process, Product, Quality and Manufacturing teams.
- ● Develop machine recipes, tooling and process parameters.
- ● Support DOE, process characterization and improvement projects.
- ● Drive yield, cycle time and productivity improvements.
- ● Maintain engineering documentation and compliance requirements.
Requirements
- ● Bachelor Degree in Engineering.
- ● 3-5 years semiconductor assembly experience.
- ● Experience with Die Attach, Wire Bond, Sintering, Molding, Singulation or related equipment.
- ● Familiar with SPC, FMEA, 8D and DOE methodologies.
- ● Strong analytical and communication skills.
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